基于锁相环加热器控制系统的温度稳定微机电系统振荡器

Zhengzheng Wu, M. Rais-Zadeh
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引用次数: 16

摘要

在这项工作中,使用氧化物填充工艺来消除硅MEMS谐振器的一阶频率温度系数(TCF),并实现高热阻隔离结构。该技术能够制造出低功耗的烤箱微平台,在该平台上可以集成多个MEMS器件。利用两个谐振器的固有频率-温度特性进行温度传感,并在特定温度下通过两个MEMS振荡器锁相实现烤箱闭环控制。基于锁相环的控制电路在0.18 μm CMOS中实现,与MEMS谐振器接口。在-40°C至70°C范围内,蒸煮MEMS振荡器的总体频率漂移为±5.5 ppm。该MEMS振荡器在闭环运行中表现出接近零的相位噪声退化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A temperature-stable mems oscillator on an ovenized micro-platform using a PLL-based heater control system
In this work, an oxide-refill process is used to null the first-order temperature coefficient of frequency (TCF) of silicon MEMS resonators and to achieve high thermal resistance isolation structures. The technology enables fabrication of a low-power ovenized micro-platform on which multiple MEMS devices can be integrated. The intrinsic frequency-temperature characteristic of two resonators is utilized for temperature sensing, and closed-loop oven control is realized by phase-locking two MEMS oscillators at a specific temperature. PLL-based control circuitry is implemented in 0.18 μm CMOS to interface with the MEMS resonators. The ovenized MEMS oscillator exhibits an overall frequency drift of ± 5.5 ppm over -40 °C to 70 °C. The MEMS oscillator exhibits near zero phase noise degradation in closed-loop operation.
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