浮动散热片对高密度BGA封装的影响

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) Pub Date : 2002-08-07 DOI:10.1109/ECTC.2002.1008348

V. Varadarajan, B.C. Kim, Dae-Hyun Han

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引用次数: 2

摘要

本文研究了热传导器对球栅阵列封装的影响。我们模拟了一个在BGA封装内的快速开关CMOS逆变器，包括电源、信号和地平面。通过仿真研究了不同散热片结构对电辐射和信号完整性的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Effects of floating heat spreader in high density BGA packages

In this paper we present the effects of heat spreader on a ball grid array (BGA) package. We have simulated a fast switching CMOS inverter inside a BGA package with power, signal and ground planes. We performed simulations to study the effects of the electrical radiation and signal integrity with different configurations of heat spreader.

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52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)

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