系统可靠性测试中故障插入的物理缺陷建模

Zhaobo Zhang, Zhanglei Wang, Xinli Gu, K. Chakrabarty
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引用次数: 14

摘要

硬件故障插入测试(FIT)是一种很有前途的系统可靠性测试和诊断覆盖率测量方法。它提高了在制造前发布质量诊断程序的速度,并提供了非常复杂的大型系统的容错反馈。某些级别的容错不足可以在当前系统中修复,但其他可能需要ASIC或整个系统架构修改。FIT是通过在模块的引脚级别引入人工故障(缺陷建模)来实现的,以模拟模块内的任何物理缺陷行为,例如SEU(单事件破坏)或逃逸延迟缺陷。提出了一种引脚故障插入的硬件结构解决方案。我们还提出了FIT模块引脚选择子集的仿真框架和优化技术,这样由于相关实现的成本,在有限的FIT引脚约束下获得所需的覆盖。给出了选定的ISCAS和OpenCore基准测试以及工业电路的实验结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Physical defect modeling for fault insertion in system reliability test
Hardware fault-insertion test (FIT) is a promising method for system reliability test and diagnosis coverage measurement. It improves the speed of releasing a quality diagnostic program before manufacturing and provides feedbacks of fault tolerance of a very complicated large system. Certain level insufficient fault tolerance can be fixed in the current system but others may require ASIC or overall system architectural modifications. The FIT is achieved by introducing an artificial fault (defect modeling) at the pin level of a module to mimic any physical defect behavior within the module, such as SEU (Single Event Upset) or escaped delay defect. We present a hardware architectural solution for pin fault insertion. We also present a simulation framework and optimization techniques for a subset of module pin selection for FIT, such that desired coverage are obtained under the constraints of limited FIT pins due to the costs of the associated implementation. Experimental results are presented for selected ISCAS and OpenCore benchmarks, as well as for an industrial circuit.
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