Yen-Ling Chen, Shih-Hao Lai, Jian-Hao Lin, B. Tsui
{"title":"一种用于评价ti-铝合金/p型4H-SiC触点界面均匀性的多触点六端跨桥开尔文电阻(CBKR)结构","authors":"Yen-Ling Chen, Shih-Hao Lai, Jian-Hao Lin, B. Tsui","doi":"10.1109/ICMTS55420.2023.10094097","DOIUrl":null,"url":null,"abstract":"A multi-contact six-terminal cross-bridge Kelvin resistor (CBKR) structure is proposed to characterize the Ti-Al alloy/p-type 4H-SiC contact. It is confirmed that the test structure can judge the uniformity of the contact interface without destructive analysis such as cross-sectional transmission electron microscopy. Comparing with the results of singlecontact CBKR structure, it is observed that the contact interface is non-uniform and the formation of low resistivity interface depends on the contact area. This area-dependence issue should be solved in order to improve the SiC power devices and CMOS ICs.","PeriodicalId":275144,"journal":{"name":"2023 35th International Conference on Microelectronic Test Structure (ICMTS)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"A multi-contact six-terminal cross-bridge Kelvin resistor (CBKR) structure for evaluation of interface uniformity of the Ti-Al alloy/p-type 4H-SiC contact\",\"authors\":\"Yen-Ling Chen, Shih-Hao Lai, Jian-Hao Lin, B. Tsui\",\"doi\":\"10.1109/ICMTS55420.2023.10094097\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A multi-contact six-terminal cross-bridge Kelvin resistor (CBKR) structure is proposed to characterize the Ti-Al alloy/p-type 4H-SiC contact. It is confirmed that the test structure can judge the uniformity of the contact interface without destructive analysis such as cross-sectional transmission electron microscopy. Comparing with the results of singlecontact CBKR structure, it is observed that the contact interface is non-uniform and the formation of low resistivity interface depends on the contact area. This area-dependence issue should be solved in order to improve the SiC power devices and CMOS ICs.\",\"PeriodicalId\":275144,\"journal\":{\"name\":\"2023 35th International Conference on Microelectronic Test Structure (ICMTS)\",\"volume\":\"29 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-03-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2023 35th International Conference on Microelectronic Test Structure (ICMTS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMTS55420.2023.10094097\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 35th International Conference on Microelectronic Test Structure (ICMTS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMTS55420.2023.10094097","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A multi-contact six-terminal cross-bridge Kelvin resistor (CBKR) structure for evaluation of interface uniformity of the Ti-Al alloy/p-type 4H-SiC contact
A multi-contact six-terminal cross-bridge Kelvin resistor (CBKR) structure is proposed to characterize the Ti-Al alloy/p-type 4H-SiC contact. It is confirmed that the test structure can judge the uniformity of the contact interface without destructive analysis such as cross-sectional transmission electron microscopy. Comparing with the results of singlecontact CBKR structure, it is observed that the contact interface is non-uniform and the formation of low resistivity interface depends on the contact area. This area-dependence issue should be solved in order to improve the SiC power devices and CMOS ICs.