基于三维电磁场模拟器的SMA 50 Ω负载设计:与现实的比较

M. Randus, K. Hoffmann
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引用次数: 3

摘要

本文的主题是将0603尺寸SMD电阻器的三维电磁场仿真结果与通过精确矢量测量获得的相应实际数据进行比较。利用CST Microwave Studio三维电磁场模拟器和时域求解器进行仿真。以一种由普通SMA法兰连接器和一组0603尺寸SMD电阻组成的优化50 ω负载设计为例进行了比较。电阻器焊接在同轴SMA连接器的内导体和法兰之间。讨论了SMD电阻器的几种排列方式,从单电阻排列到四电阻排列,以及SMD电阻器电阻层的不同方向。实际SMA连接器内导体的步进不连续随后也参与了三维电磁场模拟,并将这些结果与精确的矢量测量进行了比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design of SMA 50 Ω Load Using 3D EM Field Simulator: Comparison with Reality
The subject of this paper is to provide a comparison of 3D EM field simulation results of 0603 size SMD resistors with corresponding real data obtained by precise vector measurements. The simulated results were obtained by 3D EM field simulator CST Microwave Studio with time-domain solver. The comparison is shown on a design of an optimized 50 Omega load composed of a common SMA flange connector and a set of 0603 size SMD resistors. The resistors are soldered between the inner conductor of the coaxial SMA connector and the flange. Several arrangements of the SMD resistors ranging from single-resistor arrangement to four-resistor pattern as well as different orientation of the resistive layer of the SMD resistors are discussed. Step discontinuity of the inner conductor of a real SMA connector is subsequently also involved in 3D EM field simulation and these results are compared with precise vector measurements.
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