A. E. Abejide, Madhava Reddy Kota, Sushma Pandey, O. Aboderin, Cátia Pinho, M. Lima, A. Teixeira
{"title":"接入网的直接和外部混合调制方法","authors":"A. E. Abejide, Madhava Reddy Kota, Sushma Pandey, O. Aboderin, Cátia Pinho, M. Lima, A. Teixeira","doi":"10.5772/intechopen.96085","DOIUrl":null,"url":null,"abstract":"The demand for low-cost high-speed transmission is a major challenge for 5G future networks. To meet this optical communication demand, holistic and painstaking approaches are required in designing a simplified system model. Since the demands for high bandwidth are growing at unprecedented speed as we approach the Zettabyte era, it is crucial to minimize chromatic dispersion (CD) associated to high bit-rate signals. Mitigating CD electronically comes at high cost which may not be compatible with 5G. Photonic Integrated Circuit (PIC) as an enabler for fast speed optical transmission is still undergoing its growth stage and its major speed and efficiency have not yet been attained. However, proper and right combination of components and approaches can potentiate this technology in a more cost-efficient way. Hybrid modulation (HM)-PIC presents a simplified approach in terms of cost and efficiency for 5G networks. Hybridization of existing modulation components and approaches in PIC can enhance the generation of high bit-rate signals without the need for electrical CD compensation. A detailed study of hybrid multilevel signal modulation concept as a valuable solution for Data Centers (DC) high data-rate signals and next-generation Passive Optical Networks (PONs) is proposed.","PeriodicalId":296286,"journal":{"name":"Network-on-Chip [Working Title]","volume":"137 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-08-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Direct and External Hybrid Modulation Approaches for Access Networks\",\"authors\":\"A. E. Abejide, Madhava Reddy Kota, Sushma Pandey, O. Aboderin, Cátia Pinho, M. Lima, A. Teixeira\",\"doi\":\"10.5772/intechopen.96085\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The demand for low-cost high-speed transmission is a major challenge for 5G future networks. To meet this optical communication demand, holistic and painstaking approaches are required in designing a simplified system model. Since the demands for high bandwidth are growing at unprecedented speed as we approach the Zettabyte era, it is crucial to minimize chromatic dispersion (CD) associated to high bit-rate signals. Mitigating CD electronically comes at high cost which may not be compatible with 5G. Photonic Integrated Circuit (PIC) as an enabler for fast speed optical transmission is still undergoing its growth stage and its major speed and efficiency have not yet been attained. However, proper and right combination of components and approaches can potentiate this technology in a more cost-efficient way. Hybrid modulation (HM)-PIC presents a simplified approach in terms of cost and efficiency for 5G networks. Hybridization of existing modulation components and approaches in PIC can enhance the generation of high bit-rate signals without the need for electrical CD compensation. A detailed study of hybrid multilevel signal modulation concept as a valuable solution for Data Centers (DC) high data-rate signals and next-generation Passive Optical Networks (PONs) is proposed.\",\"PeriodicalId\":296286,\"journal\":{\"name\":\"Network-on-Chip [Working Title]\",\"volume\":\"137 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-08-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Network-on-Chip [Working Title]\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.5772/intechopen.96085\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Network-on-Chip [Working Title]","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.5772/intechopen.96085","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Direct and External Hybrid Modulation Approaches for Access Networks
The demand for low-cost high-speed transmission is a major challenge for 5G future networks. To meet this optical communication demand, holistic and painstaking approaches are required in designing a simplified system model. Since the demands for high bandwidth are growing at unprecedented speed as we approach the Zettabyte era, it is crucial to minimize chromatic dispersion (CD) associated to high bit-rate signals. Mitigating CD electronically comes at high cost which may not be compatible with 5G. Photonic Integrated Circuit (PIC) as an enabler for fast speed optical transmission is still undergoing its growth stage and its major speed and efficiency have not yet been attained. However, proper and right combination of components and approaches can potentiate this technology in a more cost-efficient way. Hybrid modulation (HM)-PIC presents a simplified approach in terms of cost and efficiency for 5G networks. Hybridization of existing modulation components and approaches in PIC can enhance the generation of high bit-rate signals without the need for electrical CD compensation. A detailed study of hybrid multilevel signal modulation concept as a valuable solution for Data Centers (DC) high data-rate signals and next-generation Passive Optical Networks (PONs) is proposed.