用劈裂圆柱谐振腔法测量低损耗金刚石薄膜在Ka波段的微波介电特性

2015 IEEE International Vacuum Electronics Conference (IVEC) Pub Date : 2015-04-27 DOI:10.1109/IVEC.2015.7224031

Yanqing Liu, M. Ding, J. Su, Jianmin She, W. Tang

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引用次数: 0

摘要

金刚石薄膜的优异性能使其在微波真空器件，特别是大功率条件下的应用具有极大的吸引力。然而，由于材料的介电损耗低，厚度小(通常小于0.5mm)，使得其微波介电性能难以测量。在本文中，我们描述了一个分裂圆柱谐振器的构造和仪器在测量金刚石薄膜，以及蓝宝石和单晶石英薄膜样品在ka波段的介电特性中的应用。结果表明，分体谐振器可以满足金刚石薄膜等低损耗薄膜材料微波介电特性测量的要求。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Measurement of microwave dielectric properties of low loss diamond film at Ka band using the split-cylinder resonator method

The excellent properties of diamond films make it extremely attractive to apply the material in microwave vacuum devices, in particular in high-power conditions. However, low dielectric loss and small thickness (usual less than 0.5mm) of the material make it difficult to measure its microwave dielectric properties. In this paper, we describe construction of a split-cylinder resonator and application of the apparatus in measuring dielectric properties of a diamond film, together with a sapphire and a single-crystal quartz thin film sample at Ka-band. Results show that the split-cylinder resonator could meet the requirement to measure microwave dielectric properties of low loss thin film materials such as diamond films.

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2015 IEEE International Vacuum Electronics Conference (IVEC)

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