用解析、数值和实验方法分析硅膜压力传感器的性能

A. Wymyslowski, A. Gorecka-Drzazga, K. Sareło
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引用次数: 1

摘要

微系统应用中有越来越多的精密传感器,这似乎吸引了工程师们的注意力。有各种各样的传感器类型,包括压力,温度,加速处理,光学,磁,化学等。在许多传感器中,关键传感元件通常是由硅制成的。硅的力学性能是突出的,从技术的角度来看,将其塑造成复杂的三维结构的技术是众所周知的。大多数情况下,MEMS传感器是任何电子系统的组成部分。目前研究的重点是基于光学膜挠度检测的MEMS硅压力传感器,该传感器可用于恶劣环境下的压力检测。这项工作的目标是应用数值模拟和分析分析,最后通过实验结果进行跟踪和验证,以定义传感器RSM(响应面模型)模型,该模型可以直接用于电子系统的复杂数值原型,例如SPICE/VERILOG类型的模拟器。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Analytical, numerical and experimental approach to analysis properties of a silicon membrane pressure sensor
There are more and more sophisticated sensors in microsystem applications, which seem to rivet the engineers' attention. There is an extraordinary variety of sensors types which includes pressure, temperature, acceleration processing, optical, magnetic, chemical etc. In a number of sensors the critical sensing element most often is made of a silicon. The mechanical properties of silicon are outstanding and techniques for shaping it into complex three-dimensional structures are well known and mastered from the technological point of view. Most often MEMS sensor are integral part of any electronic system. The main attention of the current research was MEMS silicon pressure sensor based on an optical detection of a membrane deflection, which can be used for a pressure detection in harsh environment. The goal of the work was to apply a numerical simulation along with an analytical analysis, which were finally followed up and validated by the experimental results in order to define the sensor RSM (Response Surface Models) model, which can be used directly in complex numerical prototyping of electronic systems using, e.g. SPICE/VERILOG type of simulators.
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