Multi-die Integration Using Advanced Packaging Technologies

This paper presents a review of 2-D and 3-D multi-die integration technologies and focuses on on-package multi-die co-integration to create new types of system platforms. These dice may or may not be implemented in the same technology process. The paper first presents the challenges of process scaling and coexistence of logic, IO, and RF, and discusses new system/platform requirements from emerging applications. Following the motivation, a review of multi-die integration technologies with a focus on-package 2-D and 3-D multi-die integration and process enhancements for its support is provided. Finally, we present three new multi-die platforms which embody recent innovations in system platform integration to create new FPGA and CPU architectures which can be used to efficiently implement AI, HPC, and machine learning algorithms.