用于低功耗电子器件的隧道场效应管的发展趋势和挑战

R. Rooyackers
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引用次数: 1

摘要

对低功耗电子器件的追求推动了对替代器件架构的广泛研究。为了保持足够大的ION/IOFF电流比,需要像mosfet那样具有低于60mV/ 10年限制的亚阈值摆幅(SS)的器件。隧道场效应管(TFET)承诺SS小于60mV/dec,因此被认为是替代mosfet的低功率应用的有趣候选者。然而,由于硅的间接带隙大,导致全硅tfet的带间隧道效率小,导致导通电流低。因此,为了提高隧道效率、异质集成和不同的ttfet器件结构,我们讨论了III-V化合物或锗等具有更小带隙和更小有效质量的新材料。二维半导体材料也在研究tfet的可能应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Trends and challenges in Tunnel-FETs for low power electronics
The quest for low power electronics has driven extensive research on alternative device architectures. To maintain a sufficiently large ION/IOFF current ratio, devices with a subthreshold swing (SS) below the 60mV/decade limit as for MOSFETs are needed. Tunnel-FETs (TFET) promise a SS smaller than 60mV/dec and are therefore considered as interesting candidates to replace MOSFETs for low-power applications. However, the small band-to-band-tunneling efficiency due to the large indirect bandgap of silicon results in low on-currents of all-silicon TFETs. Therefore, new materials such as III-V compounds or germanium, featuring lower bandgaps and smaller effective mass to improve the tunneling efficiency, heterogeneous integration and different TFET device architectures are discussed. 2D semiconductors materials are also investigated for possible application in TFETs.
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