各向同性导电胶粘剂研究进展综述

Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Pub Date : 2006-06-27 DOI:10.1109/HDP.2006.1707596

D. Lu, C. Wong

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引用次数: 9

摘要

迫切需要无铅和环保的互连键合工艺。其中的可能性是导电粘合剂(ECAs)和无铅焊料(Codenhead, R.和DeCoursy, D.， 1985)。与焊接技术相比，ECA技术可以提供许多优点，例如更少的加工步骤，从而降低了加工成本，更低的加工温度，使得使用热敏和低成本的基板成为可能，以及精细的间距能力

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Overview of recent advances on isotropic conductive adhesives

Lead-free and environmentally sound interconnect bonding processes are urgently needed. Among the possibilities are electrically conductive adhesives (ECAs) and lead-free solders (Codenhead, R. and DeCoursy, D., 1985). Compared to soldering technology, ECA technology can offer numerous advantages such as fewer processing steps which reduces processing cost, lower processing temperature which makes the use of heat-sensitive and low cost substrate possible, and fine pitch capability

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Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.

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