直径对TFET传导机制的影响

V. B. Sivieri, P. Agopian, J. Martino
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引用次数: 2

摘要

本文通过仿真分析研究了直径对TFET导通机制的影响及其对器件性能的影响。结果表明,在直径较小的nw - tfet中,更高的电流水平和更低的栅极电压可以达到带到带的隧穿状态。在较窄器件的传递特性曲线中发现了一些与性能退化有关的异常(D <;并根据模拟能带图和隧道速率值进行了分析。在高栅极电压下,直径为10 nm的Si NW-TFET的漏极电流比较大的纳米线低约3个数量级,这是由于源/沟道交界处的栅极/源重叠区域的存在。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Impact of diameter on TFET conduction mechanisms
In this work, the impact of diameter on the TFET conduction mechanisms and the consequent influence on the device performance is investigated through simulation analysis. The results show a higher current level and a lower gate voltage to reach the band-to-band tunneling regime in NW-TFETs with smaller diameters. Some anomalies related to the performance degradation were found in the transfer characteristic curves of the narrower devices (D <; 30 nm) and are analyzed based on the simulated energy band diagrams and tunneling rate values. The Si NW-TFET with 10 nm diameter presented a drain current approximately 3 orders of magnitude lower than the larger nanowires at high gate voltages due to presence of gate/source overlap region in abrupt source/channel junction.
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