氧等离子体处理对非晶IGZO薄膜晶体管的影响

Yi Liang, Dedong Han, Wen Yu, Junchen Dong, Huijin Li, Yi Wang
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引用次数: 0

摘要

采用室温射频磁控溅射法制备了玻璃基板上的全透明铟镓锌氧化物薄膜晶体管。分析了氧等离子体处理技术对IGZO TFTs特性的影响。在源极/漏极生长之前,采用不同功率的氧等离子体对源极/漏极表面进行处理。实验结果表明,等离子体处理可以提高器件的性能。与对照组相比,O2等离子体处理时间为10秒,功率为150W的TFTs表现出更好的性能。离子/离合比从2.67×104提高到2.1×105,增加了一个数量级,饱和迁移率(μsat)从0.54 cm2 V-1 s-1提高到1.1cm2 V-1 s-1。亚阈值摆幅(SS)为0.42V/dec,离子/开关比为2.1×105。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Influence of Oxygen Plasma Treatment on the Amorphous IGZO Thin Film Transistors
Fully transparent indium gallium zinc oxide thin film transistors (IGZO TFTs) on glass substrate were fabricated by radio frequency magnetron sputtering at room temperature. The influence of oxygen plasma treatment technology on the characteristics of IGZO TFTs were analyzed. Before growing the source/drain electrodes, different power of oxygen plasma were used to treat the surface of the source/drain region. The experiment results suggest that the plasma treatment can improve the performance of device. Compared with the control group, the TFTs with O2 plasma treatment for 10 seconds and power of 150W show a better performance. The Ion/Ioff ratio was increased by an order of magnitude from 2.67×104 to 2.1×105, and the saturation mobility (μsat) was doubled from 0.54 cm2 V-1 s-1 to 1.1cm2 V-1 s-1. The sub-threshold swing (SS) is 0.42V/dec, and Ion/Ioff ratio is 2.1×105.
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