{"title":"项目委员会成员","authors":"S. Gopalakrishnan","doi":"10.1109/GCCW.2006.74","DOIUrl":null,"url":null,"abstract":"Program Committee Members Hung-Chang Hsiao, National Cheng Kung University Gabor Kecskemeti, MTA SZTAKI Chandra Sekaran, NITK Xiaofei Wang, Seoul National University Craig Lee, The Aerospace Corporation Francisco Brasileiro, UFCG Saeid Abolfazli, University of Malaya Syed Ali Haider, SEECS-NUST Sheng Di, INRIA Vineet Chadha, Nvelo R& D, Samsung Josef Spillner, TU Dresden Eduardo Jacob, University of the Basque Country Gilles Fedak, INRIA, University of Lyon Ramin Yahyapour, GWDG University of Göttingen Erwin Laure, KTH/PDC Jiannong Cao, Hong Kong Polytechnic University Hong Xu, City University of Hong Kong Hemant Mehta, Senior Member, IEEE Xingwei Wang, Northeastern University Chunming Hu, Beihang University Alexandru Iosup, Delft University of Technology Annette Bieniusa, University of Kaiserslautern Thomas Bauschert, TU Chemnitz Pietro Michiardi, Eurecom Annappa B, NITK Tyng-Yeu Liang, National Kaohsiung University of Applied Sciences Oliver Hohlfeld, RWTH Aachen University Bo Yang, University of Electronic Science and Technology of China Jakub Szefer, Yale University David Hausheer, TU Darmstadt Rajesh Ingle, IEEE Pune Section Wolfgang Kellerer, Technische Universität München Tamas Lukovszki, Eötvös Loránd University, Budapest Burkhard Stiller, University of Zurich","PeriodicalId":432937,"journal":{"name":"2021 IEEE/ACM Sixth International Workshop on Emotion Awareness in Software Engineering (SEmotion)","volume":"57 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-05-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Program Committee Members\",\"authors\":\"S. Gopalakrishnan\",\"doi\":\"10.1109/GCCW.2006.74\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Program Committee Members Hung-Chang Hsiao, National Cheng Kung University Gabor Kecskemeti, MTA SZTAKI Chandra Sekaran, NITK Xiaofei Wang, Seoul National University Craig Lee, The Aerospace Corporation Francisco Brasileiro, UFCG Saeid Abolfazli, University of Malaya Syed Ali Haider, SEECS-NUST Sheng Di, INRIA Vineet Chadha, Nvelo R& D, Samsung Josef Spillner, TU Dresden Eduardo Jacob, University of the Basque Country Gilles Fedak, INRIA, University of Lyon Ramin Yahyapour, GWDG University of Göttingen Erwin Laure, KTH/PDC Jiannong Cao, Hong Kong Polytechnic University Hong Xu, City University of Hong Kong Hemant Mehta, Senior Member, IEEE Xingwei Wang, Northeastern University Chunming Hu, Beihang University Alexandru Iosup, Delft University of Technology Annette Bieniusa, University of Kaiserslautern Thomas Bauschert, TU Chemnitz Pietro Michiardi, Eurecom Annappa B, NITK Tyng-Yeu Liang, National Kaohsiung University of Applied Sciences Oliver Hohlfeld, RWTH Aachen University Bo Yang, University of Electronic Science and Technology of China Jakub Szefer, Yale University David Hausheer, TU Darmstadt Rajesh Ingle, IEEE Pune Section Wolfgang Kellerer, Technische Universität München Tamas Lukovszki, Eötvös Loránd University, Budapest Burkhard Stiller, University of Zurich\",\"PeriodicalId\":432937,\"journal\":{\"name\":\"2021 IEEE/ACM Sixth International Workshop on Emotion Awareness in Software Engineering (SEmotion)\",\"volume\":\"57 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-05-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 IEEE/ACM Sixth International Workshop on Emotion Awareness in Software Engineering (SEmotion)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/GCCW.2006.74\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE/ACM Sixth International Workshop on Emotion Awareness in Software Engineering (SEmotion)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GCCW.2006.74","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
摘要
项目委员会成员肖洪昌、国立成功大学Gabor keskemeti、MTA SZTAKI Chandra Sekaran、NITK Xiaofei Wang、首尔国立大学Craig Lee、航空航天公司Francisco Brasileiro、UFCG Saeid Abolfazli、马来西亚大学Syed Ali Haider、SEECS-NUST Sheng Di、INRIA Vineet Chadha、Nvelo r&d、Samsung Josef Spillner、TU Dresden Eduardo Jacob、巴斯克地区大学Gilles Fedak、INRIA、里昂大学Ramin Yahyapour、GWDG大学Göttingen Erwin Laure, KTH/PDC曹建农,香港理工大学徐宏,香港城市大学Hemant Mehta,资深会员,IEEE王兴伟,东北大学胡春明,北京航空航天大学Alexandru Iosup, Delft工业大学Annette Bieniusa,凯泽斯劳滕大学Thomas Bauschert, TU Chemnitz Pietro Michiardi, Eurecom Annappa B, NITK ting - yeu Liang,国立高雄应用科技大学Oliver Hohlfeld,亚琛工业大学杨博,中国电子科技大学Jakub Szefer,耶鲁大学David Hausheer,德国达姆施塔特工业大学Rajesh Ingle, IEEE浦那组Wolfgang Kellerer, Technische Universität m nchen Tamas Lukovszki, Eötvös Loránd布达佩斯大学Burkhard Stiller,苏黎世大学
Program Committee Members Hung-Chang Hsiao, National Cheng Kung University Gabor Kecskemeti, MTA SZTAKI Chandra Sekaran, NITK Xiaofei Wang, Seoul National University Craig Lee, The Aerospace Corporation Francisco Brasileiro, UFCG Saeid Abolfazli, University of Malaya Syed Ali Haider, SEECS-NUST Sheng Di, INRIA Vineet Chadha, Nvelo R& D, Samsung Josef Spillner, TU Dresden Eduardo Jacob, University of the Basque Country Gilles Fedak, INRIA, University of Lyon Ramin Yahyapour, GWDG University of Göttingen Erwin Laure, KTH/PDC Jiannong Cao, Hong Kong Polytechnic University Hong Xu, City University of Hong Kong Hemant Mehta, Senior Member, IEEE Xingwei Wang, Northeastern University Chunming Hu, Beihang University Alexandru Iosup, Delft University of Technology Annette Bieniusa, University of Kaiserslautern Thomas Bauschert, TU Chemnitz Pietro Michiardi, Eurecom Annappa B, NITK Tyng-Yeu Liang, National Kaohsiung University of Applied Sciences Oliver Hohlfeld, RWTH Aachen University Bo Yang, University of Electronic Science and Technology of China Jakub Szefer, Yale University David Hausheer, TU Darmstadt Rajesh Ingle, IEEE Pune Section Wolfgang Kellerer, Technische Universität München Tamas Lukovszki, Eötvös Loránd University, Budapest Burkhard Stiller, University of Zurich