一种新的功率多芯片模块封装技术

Conference Record of the 1999 IEEE Industry Applications Conference. Thirty-Forth IAS Annual Meeting (Cat. No.99CH36370) Pub Date : 1999-10-03 DOI:10.1109/IAS.1999.805978

C. Gillot, D. Henry, C. Schaeffer, C. Massit

{"title":"一种新的功率多芯片模块封装技术","authors":"C. Gillot, D. Henry, C. Schaeffer, C. Massit","doi":"10.1109/IAS.1999.805978","DOIUrl":null,"url":null,"abstract":"A new packaging technique for power multichip modules has been developed. The components are sandwiched between two DBC (direct bond copper) substrates with aluminum nitride. This innovative technique allows to replace wire bond with flip chip and to cool the module on both sides. Thus, electrical, thermal and reliability performance can be improved.","PeriodicalId":125787,"journal":{"name":"Conference Record of the 1999 IEEE Industry Applications Conference. Thirty-Forth IAS Annual Meeting (Cat. No.99CH36370)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":"{\"title\":\"A new packaging technique for power multichip modules\",\"authors\":\"C. Gillot, D. Henry, C. Schaeffer, C. Massit\",\"doi\":\"10.1109/IAS.1999.805978\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A new packaging technique for power multichip modules has been developed. The components are sandwiched between two DBC (direct bond copper) substrates with aluminum nitride. This innovative technique allows to replace wire bond with flip chip and to cool the module on both sides. Thus, electrical, thermal and reliability performance can be improved.\",\"PeriodicalId\":125787,\"journal\":{\"name\":\"Conference Record of the 1999 IEEE Industry Applications Conference. Thirty-Forth IAS Annual Meeting (Cat. No.99CH36370)\",\"volume\":\"22 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-10-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"10\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Conference Record of the 1999 IEEE Industry Applications Conference. Thirty-Forth IAS Annual Meeting (Cat. No.99CH36370)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IAS.1999.805978\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Conference Record of the 1999 IEEE Industry Applications Conference. Thirty-Forth IAS Annual Meeting (Cat. No.99CH36370)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IAS.1999.805978","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 10

摘要

提出了一种新的功率多芯片模块封装技术。元件夹在两个DBC(直接结合铜)衬底与氮化铝之间。这种创新技术允许用倒装芯片取代线键，并在两侧冷却模块。因此，电气、热学和可靠性性能可以得到改善。

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A new packaging technique for power multichip modules

A new packaging technique for power multichip modules has been developed. The components are sandwiched between two DBC (direct bond copper) substrates with aluminum nitride. This innovative technique allows to replace wire bond with flip chip and to cool the module on both sides. Thus, electrical, thermal and reliability performance can be improved.

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Conference Record of the 1999 IEEE Industry Applications Conference. Thirty-Forth IAS Annual Meeting (Cat. No.99CH36370)

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