{"title":"木材和木材缺陷检测和分级用超声","authors":"M. Schafer","doi":"10.1109/ULTSYM.2000.922658","DOIUrl":null,"url":null,"abstract":"Ultrasonic inspection of solid wood and lumber has been investigated for over 20 years, with limited commercial impact. Potential applications run from logs to finished boards, with the goal of either characterizing internal defects (knots, splits, rot), or assessing overall strength. This paper reviews recent efforts to apply ultrasound technology to the Forest Products industry.","PeriodicalId":350384,"journal":{"name":"2000 IEEE Ultrasonics Symposium. Proceedings. An International Symposium (Cat. No.00CH37121)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-10-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"18","resultStr":"{\"title\":\"Ultrasound for defect detection and grading in wood and lumber\",\"authors\":\"M. Schafer\",\"doi\":\"10.1109/ULTSYM.2000.922658\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Ultrasonic inspection of solid wood and lumber has been investigated for over 20 years, with limited commercial impact. Potential applications run from logs to finished boards, with the goal of either characterizing internal defects (knots, splits, rot), or assessing overall strength. This paper reviews recent efforts to apply ultrasound technology to the Forest Products industry.\",\"PeriodicalId\":350384,\"journal\":{\"name\":\"2000 IEEE Ultrasonics Symposium. Proceedings. An International Symposium (Cat. No.00CH37121)\",\"volume\":\"33 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-10-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"18\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2000 IEEE Ultrasonics Symposium. Proceedings. An International Symposium (Cat. No.00CH37121)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ULTSYM.2000.922658\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2000 IEEE Ultrasonics Symposium. Proceedings. An International Symposium (Cat. No.00CH37121)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ULTSYM.2000.922658","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Ultrasound for defect detection and grading in wood and lumber
Ultrasonic inspection of solid wood and lumber has been investigated for over 20 years, with limited commercial impact. Potential applications run from logs to finished boards, with the goal of either characterizing internal defects (knots, splits, rot), or assessing overall strength. This paper reviews recent efforts to apply ultrasound technology to the Forest Products industry.