原位装药技术促进了微机电系统安全防护装置的发展

Zou Jinlong, Li Xiaojie, Lei Yaru
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引用次数: 0

摘要

在阅读和分析相关文献的基础上,介绍了多孔硅含能材料和基于硅工艺的多孔金属转化原爆两种原位装药技术的基本概念和制备工艺,分析了两种原位装药技术的微给药体结构和工作原理。本文还介绍了MEMS S&A爆炸串的最新工艺。在此基础上,讨论了美国军方提出的硅MEMS S&A的结构和工作原理,认为该MEMS S&A基于原位装药,适合于圆片级批量制造。最后对硅MEMS S&A的发展提出了一些看法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Technology of in situ charge promotes the development of MEMS safety and arming device
Based on the reading and the analyzing of relative literatures, this paper introduced basic concepts and fabrication processes of two in situ charge technologies - porous silicon energetic material and converting porous metal to primary explosive based on silicon process, and analyzed the structures and working principles of the micro-donators with two in situ charge technologies. This paper also introduced latest process of explosive train of the MEMS S&A. On these bases, the structure and working principle of silicon MEMS S&A proposed by US army was discussed, and this MEMS S&A is based on in situ charge and suitable for wafer-level mass fabrication. Some views about the development of the silicon MEMS S&A were also put forward.
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