{"title":"双层球栅阵列封装单调经分配的可达性驱动修正方法","authors":"Yoichi Tomioka, A. Takahashi","doi":"10.1109/ASPDAC.2008.4483949","DOIUrl":null,"url":null,"abstract":"Ball grid array packages in which I/O pins are arranged in a grid array pattern realize a number of connections between chips and a printed circuit board, but it takes much time in manual routing. We propose a fast routing method for 2-layer ball grid array packages to support designers. Our method distributes wires evenly on top layer and increases completion ratio of nets by improving via assignment iteratively.","PeriodicalId":277556,"journal":{"name":"2008 Asia and South Pacific Design Automation Conference","volume":"135 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"Routability driven modification method of monotonic via assignment for 2-layer Ball Grid Array packages\",\"authors\":\"Yoichi Tomioka, A. Takahashi\",\"doi\":\"10.1109/ASPDAC.2008.4483949\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Ball grid array packages in which I/O pins are arranged in a grid array pattern realize a number of connections between chips and a printed circuit board, but it takes much time in manual routing. We propose a fast routing method for 2-layer ball grid array packages to support designers. Our method distributes wires evenly on top layer and increases completion ratio of nets by improving via assignment iteratively.\",\"PeriodicalId\":277556,\"journal\":{\"name\":\"2008 Asia and South Pacific Design Automation Conference\",\"volume\":\"135 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-01-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 Asia and South Pacific Design Automation Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASPDAC.2008.4483949\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 Asia and South Pacific Design Automation Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASPDAC.2008.4483949","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Routability driven modification method of monotonic via assignment for 2-layer Ball Grid Array packages
Ball grid array packages in which I/O pins are arranged in a grid array pattern realize a number of connections between chips and a printed circuit board, but it takes much time in manual routing. We propose a fast routing method for 2-layer ball grid array packages to support designers. Our method distributes wires evenly on top layer and increases completion ratio of nets by improving via assignment iteratively.