{"title":"利用自然循环从包装结构到冷却器的热传递","authors":"Hans Vesterberg","doi":"10.1109/INTLEC.1987.4794614","DOIUrl":null,"url":null,"abstract":"A calculation model for heat transfer by natural convection from vertical parallel plates with chimney is presented. Results from applications on circuit boards as well as a plate fin cooler are presented. The model is also used for calculations on the circutation from the circuit boards to the cooler.","PeriodicalId":129305,"journal":{"name":"INTELEC '87 - The Ninth International Telecommunications Energy Conference","volume":"107 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1987-06-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Heat Transfer from the Packaging Structure to the Coolers using Natural Circulation\",\"authors\":\"Hans Vesterberg\",\"doi\":\"10.1109/INTLEC.1987.4794614\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A calculation model for heat transfer by natural convection from vertical parallel plates with chimney is presented. Results from applications on circuit boards as well as a plate fin cooler are presented. The model is also used for calculations on the circutation from the circuit boards to the cooler.\",\"PeriodicalId\":129305,\"journal\":{\"name\":\"INTELEC '87 - The Ninth International Telecommunications Energy Conference\",\"volume\":\"107 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1987-06-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"INTELEC '87 - The Ninth International Telecommunications Energy Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/INTLEC.1987.4794614\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"INTELEC '87 - The Ninth International Telecommunications Energy Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/INTLEC.1987.4794614","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Heat Transfer from the Packaging Structure to the Coolers using Natural Circulation
A calculation model for heat transfer by natural convection from vertical parallel plates with chimney is presented. Results from applications on circuit boards as well as a plate fin cooler are presented. The model is also used for calculations on the circutation from the circuit boards to the cooler.
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