采用角方差通孔的基板集成波导结构(SIW)

Wissal Elahmar, T. Aguili, N. Ammar
{"title":"采用角方差通孔的基板集成波导结构(SIW)","authors":"Wissal Elahmar, T. Aguili, N. Ammar","doi":"10.1109/IINTEC.2018.8695305","DOIUrl":null,"url":null,"abstract":"In this work, a study of substrate integrated waveguide (SIW) structure is done which allows the integration of dielectric via holes in the substrate using the iterative method based on the concept of waves (WCIP). A novel development of the WCIP method is proposed that considerate the angular variance by using via holes with more important radius. These via holes delimit the guide, in which the modes will appear. In this study, not only the fundamental mode is considerate but three fundamental modes (0,1 et −1).","PeriodicalId":144578,"journal":{"name":"2018 International Conference on Internet of Things, Embedded Systems and Communications (IINTEC)","volume":"85 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Substrate integrated waveguide structures (SIW) using via holes with angular variance\",\"authors\":\"Wissal Elahmar, T. Aguili, N. Ammar\",\"doi\":\"10.1109/IINTEC.2018.8695305\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work, a study of substrate integrated waveguide (SIW) structure is done which allows the integration of dielectric via holes in the substrate using the iterative method based on the concept of waves (WCIP). A novel development of the WCIP method is proposed that considerate the angular variance by using via holes with more important radius. These via holes delimit the guide, in which the modes will appear. In this study, not only the fundamental mode is considerate but three fundamental modes (0,1 et −1).\",\"PeriodicalId\":144578,\"journal\":{\"name\":\"2018 International Conference on Internet of Things, Embedded Systems and Communications (IINTEC)\",\"volume\":\"85 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 International Conference on Internet of Things, Embedded Systems and Communications (IINTEC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IINTEC.2018.8695305\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 International Conference on Internet of Things, Embedded Systems and Communications (IINTEC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IINTEC.2018.8695305","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

本文采用基于波概念的迭代方法,对衬底集成波导(SIW)结构进行了研究,该结构允许介质通过衬底上的孔进行集成。提出了一种新的WCIP方法,通过使用具有更重要半径的通孔来考虑角方差。这些通孔划定了导线,其中将出现模式。在本研究中,不仅考虑了基本模态,而且考虑了三种基本模态(0,1 et−1)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Substrate integrated waveguide structures (SIW) using via holes with angular variance
In this work, a study of substrate integrated waveguide (SIW) structure is done which allows the integration of dielectric via holes in the substrate using the iterative method based on the concept of waves (WCIP). A novel development of the WCIP method is proposed that considerate the angular variance by using via holes with more important radius. These via holes delimit the guide, in which the modes will appear. In this study, not only the fundamental mode is considerate but three fundamental modes (0,1 et −1).
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