用器件模拟器分析场限环和场板的电位和电场分布

C. Liao, F. Chien, Y. Tsai
{"title":"用器件模拟器分析场限环和场板的电位和电场分布","authors":"C. Liao, F. Chien, Y. Tsai","doi":"10.1109/PEDS.2007.4487739","DOIUrl":null,"url":null,"abstract":"Potential and strength of surface electric field distribution have strongly influence on breakdown voltage and reliability of power semiconductor devices. Potential distribution can be determined by different field-limiting ring and field plate design which can be described by solving Poisson's equation in one dimension briefly. In this paper, the influence of design factors such as spacing between main junction and ring, ring width, and field plate width on potential and strength of surface electric field distribution are analyzed. From the simulation results, the relationship between those factors and potential and strength of surface electric field distribution can be found. Understanding the effect of design factors upon the junction termination edge, multi field-limiting rings and field plates of high breakdown power devices can be designed.","PeriodicalId":166704,"journal":{"name":"2007 7th International Conference on Power Electronics and Drive Systems","volume":"228 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Potential and Electric Field Distribution Analysis of Field Limiting Ring and Field Plate by Device Simulator\",\"authors\":\"C. Liao, F. Chien, Y. Tsai\",\"doi\":\"10.1109/PEDS.2007.4487739\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Potential and strength of surface electric field distribution have strongly influence on breakdown voltage and reliability of power semiconductor devices. Potential distribution can be determined by different field-limiting ring and field plate design which can be described by solving Poisson's equation in one dimension briefly. In this paper, the influence of design factors such as spacing between main junction and ring, ring width, and field plate width on potential and strength of surface electric field distribution are analyzed. From the simulation results, the relationship between those factors and potential and strength of surface electric field distribution can be found. Understanding the effect of design factors upon the junction termination edge, multi field-limiting rings and field plates of high breakdown power devices can be designed.\",\"PeriodicalId\":166704,\"journal\":{\"name\":\"2007 7th International Conference on Power Electronics and Drive Systems\",\"volume\":\"228 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 7th International Conference on Power Electronics and Drive Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/PEDS.2007.4487739\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 7th International Conference on Power Electronics and Drive Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/PEDS.2007.4487739","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

摘要

表面电场分布的电位和强度对功率半导体器件的击穿电压和可靠性有很大的影响。不同的限场环和场板设计可以确定电势的分布,这种分布可以用一维的泊松方程来描述。本文分析了主结与环间距、环宽度、场板宽度等设计因素对表面电场分布电位和强度的影响。从仿真结果可以看出这些因素与表面电场分布的电位和强度之间的关系。了解设计因素对结端边的影响,可以设计出高击穿功率器件的多场限环和场极板。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Potential and Electric Field Distribution Analysis of Field Limiting Ring and Field Plate by Device Simulator
Potential and strength of surface electric field distribution have strongly influence on breakdown voltage and reliability of power semiconductor devices. Potential distribution can be determined by different field-limiting ring and field plate design which can be described by solving Poisson's equation in one dimension briefly. In this paper, the influence of design factors such as spacing between main junction and ring, ring width, and field plate width on potential and strength of surface electric field distribution are analyzed. From the simulation results, the relationship between those factors and potential and strength of surface electric field distribution can be found. Understanding the effect of design factors upon the junction termination edge, multi field-limiting rings and field plates of high breakdown power devices can be designed.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信