利用三维场提取得到的互耦参数增强电路仿真

N. Moonen, F. Buesink, F. Leferink
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引用次数: 6

摘要

用等效电路模拟来预测包含元件自寄生效应的系统高频行为已经不够准确了。相互耦合,这是高度依赖于元件/走线的位置和方向,必须包括在电路模型。可以使用3D电磁场模拟来预测影响,但这既复杂又耗时。本文提出了从参数化三维模型中提取相互耦合参数的方法。在等效电路模型中对表示电磁场相互耦合的集总元件进行了反向注释。这样可以快速地进行电路仿真,并确定相互耦合的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Enhanced circuit simulation using mutual coupling parameters obtained via 3D field extraction
Predicting high frequency behavior of systems with equivalent circuit simulations that are including component self-parasitic effects are not sufficiently accurate anymore. Mutual coupling, which is highly dependent on component/traces placement and orientation, has to be included in circuit models. Predicting the impact can be performed using 3D electromagnetic field simulations, but these are complex and time consuming. This paper suggest extracting the mutual coupling parameters from a parametric 3D model. The lumped elements, which represent the mutual coupling via the electromagnetic field, are back-annotated in the equivalent circuit model. Then circuit simulations can be performed very fast and the impact of the mutual coupling can be determined.
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