一种新型兼容片外互连单匝螺旋的设计与优化

Qi Zhu, Lunyu Ma, S. Sitaraman
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引用次数: 11

摘要

随着集成电路设计和制造的快速发展不断挑战和推动电子封装技术,在细间距,高性能,低成本和良好的可靠性方面,兼容互连显示出下一代封装的巨大优势。一种新型的兼容片外互连,单匝螺旋(OTH),设计为无底填互连。它在各个方向上都具有良好的适应性,可以补偿硅芯片与有机衬底之间的热膨胀系数(CTE)失配。OTH的制造类似于标准IC制造,晶圆级封装使其具有成本效益。在这项工作中,我们研究了几何参数对OTH机械和电气性能的影响。越细越窄、半径越大、桩高越高的弧形梁具有较好的力学顺应性。然而,研究发现,具有良好力学顺应性的结构不能具有良好的电气性能。因此,OTH的设计需要权衡。采用响应面法和优化技术选择最优OTH结构参数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design and optimization of a novel compliant off-chip interconnect One-Turn Helix
As the rapid advances in IC design and fabrication continue to challenge and push the electronic packaging technology, in terms of fine pitch, high performance, low cost, and good reliability, compliant interconnects show great advantages for next-generation packaging. A novel compliant off-chip interconnect, One-Turn Helix (OTH), is designed as an underfill-free interconnect. It has excellent compliance in all directions to compensate the coefficient of thermal expansion (CTE) mismatch between the silicon die and an organic substrate. The fabrication of OTH is similar to standard IC fabrication, and wafer-level packaging makes it cost effective. In this work, we study the effect of geometry parameters on mechanical and electrical performance of OTH. Thinner and narrower arcuate beam with larger radius and taller post are found to have better mechanical compliance. However, it is found that structures with excellent mechanical compliance cannot have good electrical performance. Therefore, a trade off is needed for the design of OTH. Response surface methodology and an optimization technique have been used to select the optimal OTH structure parameters.
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