基于CNTFET-ReRAM的内存计算交叉棒网络性能分析

Huma Syed, F. A. Khanday, Furqan Zahoor, F. Hussin
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引用次数: 1

摘要

随着晶体管的规模达到其物理极限,摩尔定律的终结迫在眉睫。当前流行的CMOS技术在进一步规模化的过程中面临着短通道效应、光刻限制等严峻的设计问题。此外,处理技术的巨大进步使记忆墙的影响更加突出。由于处理时间和传输数据时间之间的差距越来越大,冯诺依曼瓶颈的严重性比以往任何时候都更加明显。因此,迫切需要在设备和架构级别转向新技术。考虑到非冯诺依曼结构和后CMOS技术的重要性,利用cntfet和ReRAM器件设计了一个基于交叉栅的NOR逻辑门,以方便内存计算。基于ReRAM的逻辑电路使用MAGIC和IMPLY已经实现,但这项工作的重点是基于比率逻辑的ReRAM- cntfet设计,因为它更好地兼容交叉结构,被认为是一个有前途的候选内存计算。在这项工作中,设计了基于CNTFET(碳纳米管场效应晶体管)-ReRAM(电阻随机存取存储器)的混合NOR逻辑门,并将其性能与基于CMOS-ReRAM的对应物进行了比较。HSPICE仿真结果表明,该器件在功耗、功率延迟积(PDP)和温度变化方面具有较好的性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Performance Analysis of CNTFET-ReRAM based Crossbar Network for In-Memory Computing
With scaling of transistors reaching its physical limits, the end of Moores law is imminent. The prevalent CMOS technologies are facing severe design issues like short channel effects, lithographic limitations etc in undergoing further scaling. Also the huge advancements made in processing technologies have made the effects of memory wall more prominent. Because of the growing divide between processing time and time taken to transfer data, the severity of Von Neumann bottleneck is being felt more than ever. Thus there is an emergent need to shift to new technologies both at device and architecture level. Keeping in view the significance of non Von Neumann architecture and post CMOS technologies, a crossbar based NOR logic gate was designed using CNTFETs and ReRAM devices to facilitate in-memory computing. ReRAM based logic circuits using MAGIC and IMPLY have been already implemented but this work focuses on ratioed logic based ReRAM-CNTFET design because of its better compatibility with crossbar architecture which is conceived to be a promising candidate for in-memory computing. In this work, hybrid CNTFET (carbon nanotube field effect transistor) -ReRAM (resistive random access memory) based NOR logic gate has been designed and its performance has been compared with its CMOS-ReRAM based counterpart. The results yielded from HSPICE simulations depict better performance in terms of power dissipation, power delay product(PDP) and temperature variation.
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