采用光切片法和智能CMOS传感器的实时高分辨率三维成像系统

Y. Oike, Hiroaki Shintaku, S. Takayama, M. Ikeda, K. Asada
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引用次数: 14

摘要

本文提出了首个基于VGA像素分辨率的光切分法实时三维成像系统。三维测量系统具有广泛的应用领域,但传统的成像系统难以实现基于光截面法的实时高分辨率三维测量,因为它需要大量的帧来获取扫描激光束的位置。我们开发的图像传感器在640 /spl倍/ 480像素分辨率下实现了41.7k / fps的投影片光束位置检测。基于FPGA的集成系统控制器实现了传感器控制、光投影控制、距离数据预处理和冗余数据传输抑制等实时系统的致命问题。我们开发的3D成像系统在1200毫米的距离上实现23.3幅距离图/秒,距离精度为0.87毫米。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Real-time and high-resolution 3D imaging system using light-section method and smart CMOS sensor
This paper presents the first real-time 3D imaging system based on the light-section method with VGA pixel resolution. A 3D measurement system has a wide variety of applications fields, however it is difficult for the conventional imaging systems to realize a real-time and high-resolution 3D measurement based on the light-section method since it requires a lot of frames per range map to acquire the positions of a scanning laser beam. Our developed image sensor achieves 41.7k fps position detection of a projected sheet beam in 640 /spl times/ 480 pixel resolution. An integrated system controller implemented on an FPGA performs sensor control, light projection control, range data pre-processing and suppression of redundant data transmission for the fatal problems of the real-time system. Our developed 3D imaging system achieves 23.3 range maps/s with 0.87 mm range accuracy at a distance of 1200 mm.
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