{"title":"RFIC，天线和RF-MEMS集成的新兴制造技术","authors":"A. Lu, K. M. Chua, L.H. Guo","doi":"10.1109/RFIT.2005.1598895","DOIUrl":null,"url":null,"abstract":"Insatiable demand for miniaturization and environmental friendly materials in next-generation electronic based products is driving the need for advanced low-cost and scalable manufacturing processes. To meet customers' needs today, ranging from communications to healthcare markets, tight integration of multiple functionalities is required. The conventional approach to multi-functional integration involves assembly and packaging of discrete components, active devices, etc. A holistic approach towards multi-functional integration to improve system cost-effectiveness, particularly for the next-generation RF microsystems and subsystems, is described, along with the unique manufacturing technologies.","PeriodicalId":337918,"journal":{"name":"2005 IEEE International Wkshp on Radio-Frequency Integration Technology: Integrated Circuits for Wideband Comm & Wireless Sensor Networks","volume":"862 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Emerging manufacturing technologies for RFIC, antenna and RF-MEMS integration\",\"authors\":\"A. Lu, K. M. Chua, L.H. Guo\",\"doi\":\"10.1109/RFIT.2005.1598895\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Insatiable demand for miniaturization and environmental friendly materials in next-generation electronic based products is driving the need for advanced low-cost and scalable manufacturing processes. To meet customers' needs today, ranging from communications to healthcare markets, tight integration of multiple functionalities is required. The conventional approach to multi-functional integration involves assembly and packaging of discrete components, active devices, etc. A holistic approach towards multi-functional integration to improve system cost-effectiveness, particularly for the next-generation RF microsystems and subsystems, is described, along with the unique manufacturing technologies.\",\"PeriodicalId\":337918,\"journal\":{\"name\":\"2005 IEEE International Wkshp on Radio-Frequency Integration Technology: Integrated Circuits for Wideband Comm & Wireless Sensor Networks\",\"volume\":\"862 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2005 IEEE International Wkshp on Radio-Frequency Integration Technology: Integrated Circuits for Wideband Comm & Wireless Sensor Networks\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RFIT.2005.1598895\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 IEEE International Wkshp on Radio-Frequency Integration Technology: Integrated Circuits for Wideband Comm & Wireless Sensor Networks","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RFIT.2005.1598895","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Emerging manufacturing technologies for RFIC, antenna and RF-MEMS integration
Insatiable demand for miniaturization and environmental friendly materials in next-generation electronic based products is driving the need for advanced low-cost and scalable manufacturing processes. To meet customers' needs today, ranging from communications to healthcare markets, tight integration of multiple functionalities is required. The conventional approach to multi-functional integration involves assembly and packaging of discrete components, active devices, etc. A holistic approach towards multi-functional integration to improve system cost-effectiveness, particularly for the next-generation RF microsystems and subsystems, is described, along with the unique manufacturing technologies.
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