瞬态浪涌电流下多电参数SiC MOS器件结温在线测量方法

Boyang Liu, Chunsheng Guo, Sijin Wang, Hang Wei, Lei Wei
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引用次数: 1

摘要

提出了一种在线测量碳化硅金属氧化物半导体场效应晶体管结温的新方法。该测量方法是在温度敏感电参数测量法(TSEP)的基础上,利用导通过程中瞬态涌流时的米勒平台电压(VGS)和源漏电流(IDS)进行测量。红外测温结果的对比表明,该方法可以提供更精确的结温结果,也可用于SiC MOSFET器件的瞬态结温测量。解决了传统的温度敏感电参数测量方法难以测量瞬态温升的问题。最后,结果表明,使用VGS和IDS可以提供更精确的结温结果,可用于SiC MOSEFT器件的瞬态结温。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Online Junction Temperature Measurement Method of SiC MOS Devices Using Multiple Electrical Parameters at Transient Surge Current
This paper proposes a novel method for online junction temperature measurement of silicon carbide metaloxide-semiconductor field-effect transistors (SiC MOSFETs). The measurement method is using the miller plateau voltage (VGS) and source leakage current (IDS) at transient inrush currents during turn-on process that based on the temperaturesensitive electrical parameters measurement method (TSEP). The comparison of infrared temperature measurement results shows that this method can provide more accurate junction temperature results and also can be used for transient junction temperature measurement in SiC MOSFET devices. It solves the problem that the traditional temperature-sensitive electrical parameter measurement method is difficult to measure the transient temperature rise. Finally, the results show that the use of VGS and IDS can provide more accurate junction temperature results which can be used for transient junction temperatures in SiC MOSEFT devices.
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