用数值去嵌入方法表征通孔不连续

2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446) Pub Date : 2003-10-14 DOI:10.1109/ISEMC.2003.1236669

G. Antonini, A. Scogna, A. Orlandi

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引用次数: 3

摘要

提出了一种多层印刷电路板中通孔散射参数S的解嵌方法。假设通孔与邻线无电磁耦合，从计算试验结构三维全波分析得到的传递散射矩阵T开始，对散射参数进行评估。通过与其他独立数值方法和实测结果的比较，验证了采用数值方法获得S和T参数的正确性。所提出的方法可以节省计算时间，并为通孔不连续的CAD建模提供有用的结果。

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Characterization of via holes discontinuities by means of numerical de-embedding

A method for de-embedding scattering parameters S of via hole in multilayer printed circuit board is presented. By assuming that the via hole is not electromagnetically coupled with the adjacent lines, the scattering parameters are evaluated starting from the calculation of the transfer scattering matrix T obtained by a three dimensional full wave analysis of the test structure. The numerical approach used to obtain S and T parameters has been validated by comparison with results computed by other independent numerical methods and measurements. The proposed methodology allows a computational time saving and gives useful results for a CAD modeling of via hole discontinuities.

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来源期刊

2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)

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