HXD2机车辅助变流器散热研究

Huang Xianjin, Z. Liwei, Sun Hu, You Xiao-jie, T. Zheng
{"title":"HXD2机车辅助变流器散热研究","authors":"Huang Xianjin, Z. Liwei, Sun Hu, You Xiao-jie, T. Zheng","doi":"10.1109/ECCE.2010.5618108","DOIUrl":null,"url":null,"abstract":"Modern AC traction locomotives, are characteristic of miniaturization, increasing switching frequency and increasing packaging densities, require increased current handling capability of packaged devices in applications related to power conversion. These ever-increasing demands pushed the efficiency of silicon semiconductor power-device to the limit. The heat dissipation in the power system must be taken into account. The temperature field of a product can be picked up to optimize the design and improve the reliability by the technology of thermal analysis in the phase of design. This paper describes results of thermal simulations in the module of HXD2 auxiliary converter with air cooling system. Integrated Thermal Analysis was conducted using the Flotherm and Icepak computational fluid dynamics (CFD) software packages. Influence of air-cooling system parameters on temperature distribution in module was also investigated. The optimized arrangement of the 6 power modules proved the results of thermal simulation of the auxiliary block.","PeriodicalId":161915,"journal":{"name":"2010 IEEE Energy Conversion Congress and Exposition","volume":"95 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Study of heat dissipation for HXD2 locomotive's auxiliary converter\",\"authors\":\"Huang Xianjin, Z. Liwei, Sun Hu, You Xiao-jie, T. Zheng\",\"doi\":\"10.1109/ECCE.2010.5618108\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Modern AC traction locomotives, are characteristic of miniaturization, increasing switching frequency and increasing packaging densities, require increased current handling capability of packaged devices in applications related to power conversion. These ever-increasing demands pushed the efficiency of silicon semiconductor power-device to the limit. The heat dissipation in the power system must be taken into account. The temperature field of a product can be picked up to optimize the design and improve the reliability by the technology of thermal analysis in the phase of design. This paper describes results of thermal simulations in the module of HXD2 auxiliary converter with air cooling system. Integrated Thermal Analysis was conducted using the Flotherm and Icepak computational fluid dynamics (CFD) software packages. Influence of air-cooling system parameters on temperature distribution in module was also investigated. The optimized arrangement of the 6 power modules proved the results of thermal simulation of the auxiliary block.\",\"PeriodicalId\":161915,\"journal\":{\"name\":\"2010 IEEE Energy Conversion Congress and Exposition\",\"volume\":\"95 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 IEEE Energy Conversion Congress and Exposition\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECCE.2010.5618108\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 IEEE Energy Conversion Congress and Exposition","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECCE.2010.5618108","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

现代交流牵引机车具有小型化、开关频率增加和封装密度增加的特点,在与功率转换有关的应用中,要求封装设备具有更高的电流处理能力。这些不断增长的需求将硅半导体功率器件的效率推向了极限。必须考虑电力系统的散热问题。热分析技术可以在设计阶段提取产品的温度场,从而优化设计,提高产品的可靠性。本文介绍了带风冷系统的HXD2辅助变流器模块的热仿真结果。使用Flotherm和Icepak计算流体动力学(CFD)软件包进行综合热分析。研究了风冷系统参数对模块温度分布的影响。6个电源模块的优化布置验证了辅助模块的热仿真结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Study of heat dissipation for HXD2 locomotive's auxiliary converter
Modern AC traction locomotives, are characteristic of miniaturization, increasing switching frequency and increasing packaging densities, require increased current handling capability of packaged devices in applications related to power conversion. These ever-increasing demands pushed the efficiency of silicon semiconductor power-device to the limit. The heat dissipation in the power system must be taken into account. The temperature field of a product can be picked up to optimize the design and improve the reliability by the technology of thermal analysis in the phase of design. This paper describes results of thermal simulations in the module of HXD2 auxiliary converter with air cooling system. Integrated Thermal Analysis was conducted using the Flotherm and Icepak computational fluid dynamics (CFD) software packages. Influence of air-cooling system parameters on temperature distribution in module was also investigated. The optimized arrangement of the 6 power modules proved the results of thermal simulation of the auxiliary block.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信