一种用于Sub-65nm节点的SRAM阵列VMIN漂移筛选方法

M. Ball, J. Rosal, R. Mckee, W. Loh, T. Houston, R. Garcia, J. Raval, D. Li, R. Hollingsworth, R. Gury, R. Eklund, J. Vaccani, B. Castellano, F. Piacibello, S. Ashburn, A. Tsao, A. Krishnan, J. Ondrusek, T. Anderson
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引用次数: 17

摘要

sram是片上系统器件的一个组成部分。随着晶体管和栅极长度扩展到65nm/45nm节点,SRAM在整个产品寿命周期内的稳定性已成为一个挑战。负偏置温度不稳定、缺陷或其他可能表现为晶体管阈值电压(VT)增加的现象会导致SRAM存储单元通过老化和/或操作导致VMIN漂移。在时间为零的直接评估是困难的,因为晶体管VT尚未移位,因此没有能力在时间为零时筛选VMIN移位。这项工作描述了德克萨斯仪器公司在65纳米低功耗和高性能工艺技术上开发的一种方法,用于在SRAM电池成为可靠性问题之前在时间零点筛选SRAM电池
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Screening Methodology for VMIN Drift in SRAM Arrays with Application to Sub-65nm Nodes
SRAMs are an integral part of system on chip devices. With transistor and gate length scaling to 65nm/45nm nodes, SRAM stability across the product's lifetime has become a challenge. Negative bias temperature instability, defects, or other phenomena that may manifest itself as a transistor threshold voltage (VT) increase can result in VMIN drift of SRAM memory cells through burn-in and/or operation. A direct assessment at time-zero is difficult because the transistor VT has not yet shifted, and therefore no capability to screen VMIN shift at time zero can be developed. This work describes a methodology developed on 65nm low power and high performance process technologies at Texas Instruments for screening SRAM cells at time zero before they become reliability issues
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