利用三维电磁场分析模拟了印刷电路板同轴通孔连接结构的高频特性

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2009-12-01 DOI:10.1109/EDAPS.2009.5403985

Yoshiyuki Takasu, K. Kikuchi, H. Nakagawa, K. Koshiji, M. Aoyagi

{"title":"利用三维电磁场分析模拟了印刷电路板同轴通孔连接结构的高频特性","authors":"Yoshiyuki Takasu, K. Kikuchi, H. Nakagawa, K. Koshiji, M. Aoyagi","doi":"10.1109/EDAPS.2009.5403985","DOIUrl":null,"url":null,"abstract":"High-speed signal transmission of over 10 Gbps is required even for the signal transmission line of printed circuit boards (PCBs). To realize high-speed signal transmission, we developed a PCB technology with a rectangular coaxial line structure. The coaxial line structure is suitable for high-speed signal transmission because of its realization of precise characteristic impedance control and low crosstalk. In this paper, we report the high-frequency characteristics of coaxial bend and via structures in comparison with those of a microstrip-line structure obtained using a three-dimensional electromagnetic field simulation.","PeriodicalId":370741,"journal":{"name":"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Simulated high-frequency characteristics of coaxial via connection structures in printed circuit boards using three-dimensional electromagnetic field analysis\",\"authors\":\"Yoshiyuki Takasu, K. Kikuchi, H. Nakagawa, K. Koshiji, M. Aoyagi\",\"doi\":\"10.1109/EDAPS.2009.5403985\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"High-speed signal transmission of over 10 Gbps is required even for the signal transmission line of printed circuit boards (PCBs). To realize high-speed signal transmission, we developed a PCB technology with a rectangular coaxial line structure. The coaxial line structure is suitable for high-speed signal transmission because of its realization of precise characteristic impedance control and low crosstalk. In this paper, we report the high-frequency characteristics of coaxial bend and via structures in comparison with those of a microstrip-line structure obtained using a three-dimensional electromagnetic field simulation.\",\"PeriodicalId\":370741,\"journal\":{\"name\":\"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS.2009.5403985\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2009.5403985","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

即使是印刷电路板(pcb)的信号传输线也需要超过10gbps的高速信号传输。为了实现高速信号传输，我们开发了一种矩形同轴线结构的PCB技术。同轴线路结构实现了精确的特性阻抗控制和低串扰，适用于高速信号传输。本文报道了同轴弯曲和通孔结构的高频特性，并将其与三维电磁场模拟得到的微带线结构的高频特性进行了比较。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Simulated high-frequency characteristics of coaxial via connection structures in printed circuit boards using three-dimensional electromagnetic field analysis

High-speed signal transmission of over 10 Gbps is required even for the signal transmission line of printed circuit boards (PCBs). To realize high-speed signal transmission, we developed a PCB technology with a rectangular coaxial line structure. The coaxial line structure is suitable for high-speed signal transmission because of its realization of precise characteristic impedance control and low crosstalk. In this paper, we report the high-frequency characteristics of coaxial bend and via structures in comparison with those of a microstrip-line structure obtained using a three-dimensional electromagnetic field simulation.

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2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)

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