{"title":"从根本上解决纳米电子学领域热物理问题的新方法","authors":"V. Khvesyuk, A. Barinov, B. Liu, W. Qiao","doi":"10.29003/m2481.mmmsec-2021/92-94","DOIUrl":null,"url":null,"abstract":"The paper discusses current problems related to the heat transfer in solid-state nanostructures: the influence of real rough boundaries on the effective thermal conductivity and contact thermal resistance","PeriodicalId":151453,"journal":{"name":"Mathematical modeling in materials science of electronic component","volume":"72 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"FUNDAMENTALLY NEW APPROACHES TO SOLVING THERMOPHYSICAL PROBLEMS IN THE FIELD OF NANOELECTRONICS\",\"authors\":\"V. Khvesyuk, A. Barinov, B. Liu, W. Qiao\",\"doi\":\"10.29003/m2481.mmmsec-2021/92-94\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper discusses current problems related to the heat transfer in solid-state nanostructures: the influence of real rough boundaries on the effective thermal conductivity and contact thermal resistance\",\"PeriodicalId\":151453,\"journal\":{\"name\":\"Mathematical modeling in materials science of electronic component\",\"volume\":\"72 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-10-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Mathematical modeling in materials science of electronic component\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.29003/m2481.mmmsec-2021/92-94\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Mathematical modeling in materials science of electronic component","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.29003/m2481.mmmsec-2021/92-94","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
FUNDAMENTALLY NEW APPROACHES TO SOLVING THERMOPHYSICAL PROBLEMS IN THE FIELD OF NANOELECTRONICS
The paper discusses current problems related to the heat transfer in solid-state nanostructures: the influence of real rough boundaries on the effective thermal conductivity and contact thermal resistance