用于物联网(IoT)的柔性氧化镓(Ga2O3)薄膜晶体管(TFTs)和电路

Sagar R. Bhalerao, D. Lupo, P. R. Berger
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引用次数: 1

摘要

尽管目前先进的硅基器件和技术可能达到其性能水平的顶峰,但仍有许多正交应用,距离他们的范围还很远。此外,由于它们的高工艺温度,仍然有许多硅无法实现的应用,即直接集成到柔性和印刷电子产品中,而不是添加预制集成电路的混合集成。这些技术可以用于低成本和一次性可穿戴医疗技术。因此,与硅性能互补的低温溶液加工氧化物半导体是即将到来的印刷、柔性和可穿戴电子革命的先决条件。本文报道了溶液加工的柔性氧化镓(Ga2O3)薄膜晶体管(TFT)和逆变电路。采用室温阳极氧化法制备了用于栅极电介质的高钾氧化铝(Al2O3)。氧化镓tft具有较高的性能,提取电子迁移率(µ)为2.74 cm2/V。s,工作电压低至3V,阈值电压(Vth) 0.61 V。通/关比104,亚阈值摆幅(SS) 0.5 V/dec,迟滞0.1 V,跨导gm为64.8µS。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Flexible, Gallium Oxide (Ga2O3) Thin Film Transistors (TFTs) and Circuits for the Internet of Things (IoT)
Even though present advanced silicon-based devices and technology could be reaching their zenith of performance levels, still there are many orthogonal applications, which are yet far from their reach. Also, due to their high process temperatures, there are still a number of applications that are out-of-reach for silicon, namely direct integration into flexible and printed electronics, as opposed to a hybrid integration of adding a prefabricated integrated circuit. These can find usage in low-cost and disposable wearable medical technologies. Therefore, the low temperature-solution processed oxide semiconductors that are complimentary to the performance of silicon are prerequisite for the forthcoming printed, flexible and wearable electronics revolution. Here, solution processed, flexible gallium oxide (Ga2O3) thin film transistors (TFT) and inverter circuit are reported. The high-K aluminium oxide (Al2O3) for the gate dielectric, was deposited with the help of a room temperature anodization process. The gallium oxide TFTs show high performance, with extracted electron mobility (µ) 2.74 cm2/V.s, operating voltage as low as 3V and threshold voltage (Vth) 0.61 V. The on/off ratio 104 and subthreshold swing (SS) 0.5 V/dec, Hysteresis 0.1 V and transconductance, gm, is 64.8 µS.
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