{"title":"低成本数据传输通过金属固体传感器网络","authors":"C. Bacher, P. Palensky, S. Mahlknecht","doi":"10.1109/ICET.2005.1558879","DOIUrl":null,"url":null,"abstract":"Thispaperpresents a low-cost andlow-power solution fordatatransmission viametallic solids. It usesultrasonic wavesinmetal pipes tocarry the information, since wireline orradio transmission is notpossible incertain cases. Thesender nodes are designed inalowpowerstyle inorder tobesupplied bybatteries. Additionally, thenodes areusing off-theshelf technology andarehighly integrated toreduce costsdramatically, compared tosimilar existing technologies.","PeriodicalId":222828,"journal":{"name":"Proceedings of the IEEE Symposium on Emerging Technologies, 2005.","volume":"50 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":"{\"title\":\"Low cost data transmission via metallic solids for sensor networking\",\"authors\":\"C. Bacher, P. Palensky, S. Mahlknecht\",\"doi\":\"10.1109/ICET.2005.1558879\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Thispaperpresents a low-cost andlow-power solution fordatatransmission viametallic solids. It usesultrasonic wavesinmetal pipes tocarry the information, since wireline orradio transmission is notpossible incertain cases. Thesender nodes are designed inalowpowerstyle inorder tobesupplied bybatteries. Additionally, thenodes areusing off-theshelf technology andarehighly integrated toreduce costsdramatically, compared tosimilar existing technologies.\",\"PeriodicalId\":222828,\"journal\":{\"name\":\"Proceedings of the IEEE Symposium on Emerging Technologies, 2005.\",\"volume\":\"50 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-12-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"16\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the IEEE Symposium on Emerging Technologies, 2005.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICET.2005.1558879\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the IEEE Symposium on Emerging Technologies, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICET.2005.1558879","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}