基于x -填充技术的VLSI测试扫描功率优化

A. Priya, K. S
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引用次数: 3

摘要

超大规模集成技术(VLSI)的进步今天已经利用了甚深亚微米(VDSM)技术。这反过来又导致晶体管密度的快速增加和便携式、电池供电、紧凑和高性能智能计算设备的扩散。这些因素使功耗最小化成为设计和测试工程师的关键定义指标。测试这样的ic应该在规划功率感知测试(包括DFT和ATPG)的各个阶段以及为低功耗EDA工具开发基础设施时考虑层次结构。在过去的十年中,随着特征尺寸减小到10nm,随着测试问题的增加,电源管理和优化已经成为事实[3]。因此,本文提出了使用x填充降低扫描功率的启发式方法,并与使用ISCAS ' 89基准电路的工业性能测试边界技术进行了比较。采用拟议的x填充技术,可以降低70%的功率。采用新技术,与普通扫描操作相比,在偏移分量的基础上平均降低63.62%,在捕获分量的基础上平均降低69.9%,x因子降低0.57。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Power Optimization of VLSI Scan under Test using X-Filling Technique
Advancements in Very Large-Scale Integrated Technology (VLSI) today has made use of Very Deep Sub-micron (VDSM) technology. This in turn, results in rapid increase in transistor density and proliferation of portable, battery-operated, compact and high-performance smart computing devices. These factors make power minimization a critical defining metric for both design & test engineers. Testing such ICs ought to consider hierarchy levels at various stages of planning a Power-Aware test (including DFT & ATPG) and while developing infrastructure for low-power EDA tools. Over past decade, power management and optimization have become de-facto along with test problem growing by few manifolds as feature size goes down to 10nm [3]. So this paper brings the heuristic approaches of reducing scan power using X-filling in comparison with industrial performance test bound techniques using ISCAS’89 Benchmarking circuits. 70% power reduction is possible using proposed X-filling technique. With novel technique, power reduction upto 63.62% on average basis on shift component and 69.9% on capture component is possible with X-factor reduced upto 0.57 compared to normal scan operation.
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