用于芯片内全局通信的多尺度自由空间光互连

Digest of the LEOS Summer Topical Meetings Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004. Pub Date : 2004-06-28 DOI:10.1109/LEOSST.2004.1338712

M. McFadden, M. Iqbal, Michael W. Haney

{"title":"用于芯片内全局通信的多尺度自由空间光互连","authors":"M. McFadden, M. Iqbal, Michael W. Haney","doi":"10.1109/LEOSST.2004.1338712","DOIUrl":null,"url":null,"abstract":"Optical intrachip global interconnects are discussed. Methods for replacing metal global interconnects with free-space optical interconnects are compared analytically to highlight the bandwidth capacity benefits of using a multiscale optical system for intrachip global communications.","PeriodicalId":280347,"journal":{"name":"Digest of the LEOS Summer Topical Meetings Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004.","volume":"130 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-06-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Multiscale free-space optical interconnects for intrachip global communications\",\"authors\":\"M. McFadden, M. Iqbal, Michael W. Haney\",\"doi\":\"10.1109/LEOSST.2004.1338712\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Optical intrachip global interconnects are discussed. Methods for replacing metal global interconnects with free-space optical interconnects are compared analytically to highlight the bandwidth capacity benefits of using a multiscale optical system for intrachip global communications.\",\"PeriodicalId\":280347,\"journal\":{\"name\":\"Digest of the LEOS Summer Topical Meetings Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004.\",\"volume\":\"130 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-06-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Digest of the LEOS Summer Topical Meetings Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/LEOSST.2004.1338712\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Digest of the LEOS Summer Topical Meetings Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/LEOSST.2004.1338712","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 4

摘要

讨论了光芯片的全局互连。分析比较了用自由空间光互连代替金属全局互连的方法，以突出使用多尺度光系统进行芯片内全局通信的带宽容量优势。

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Multiscale free-space optical interconnects for intrachip global communications

Optical intrachip global interconnects are discussed. Methods for replacing metal global interconnects with free-space optical interconnects are compared analytically to highlight the bandwidth capacity benefits of using a multiscale optical system for intrachip global communications.

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Digest of the LEOS Summer Topical Meetings Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004.

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