点状缺陷的电路级建模

D. Gaitonde, D. Walker
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引用次数: 11

摘要

描述了在标称电路的变化中映射点缺陷(例如额外/缺失材料,栅极氧化物针孔)所面临的一些问题。传统上,使用了一种非常简单的映射,假定电路故障由短路、开路和偶尔的额外设备组成。讨论了在VLASIC灾难性断层屈服模拟器中实现简单映射的一些问题及其解决方法。他们还描述了似乎需要全三维设备模拟的建模问题。最后对参数故障和功能故障的模糊界限进行了研究。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Circuit-level modeling of spot defects
Describes some of the problems faced in mapping spot defects (e.g. extra/missing material, gate oxide pinholes) to changes in the nominal circuit. Traditionally, a very simple mapping has been used, with circuit faults assumed to consist of shorts, opens and occasionally, extra devices. The authors discuss some of the problems in achieving the simple mapping and how they are solved in VLASIC catastrophic fault yield simulator. They also describe modeling problems that appear to require full 3-D device simulation. Finally some investigations into the hazy boundary between parametric and functional faults are described.<>
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