椭圆曲线密码在OMAP平台上的系统集成

Sergey Morozov, Christian Tergino, P. Schaumont
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引用次数: 11

摘要

椭圆曲线加密(ECC)在嵌入式环境中的数字签名和其他公钥加密应用中很流行。然而,ECC是计算密集型的,特别是底层模块化算法的性能仍然是一个问题。我们研究了ECC在TI的OMAP 3530平台上的设计空间,重点研究了使用OMAP的DSP内核来加速ARM Cortex A8内核的ECC计算。我们研究了高效ECC的异构平台的机会,包括在DSP上有效实现底层字段乘法,以及设计分区以最大限度地减少ARM和DSP之间的通信开销。通过将计算迁移到DSP,我们证明了底层模块化算法的显著加速,与在ARM Cortex处理器上执行的实现相比,执行时间减少了9.24倍。原型测量显示能量减少了5.3倍。我们得出结论,异构平台在性能和能源方面提供了实质性的改进,但我们也指出处理器间通信的成本不容忽视。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
System integration of Elliptic Curve Cryptography on an OMAP platform
Elliptic Curve Cryptography (ECC) is popular for digital signatures and other public-key crypto-applications in embedded contexts. However, ECC is computationally intensive, and in particular the performance of the underlying modular arithmetic remains a concern. We investigate the design space of ECC on TI's OMAP 3530 platform, with a focus on using OMAP's DSP core to accelerate ECC computations for the ARM Cortex A8 core. We examine the opportunities of the heterogeneous platform for efficient ECC, including the efficient implementation of the underlying field multiplication on the DSP, and the design partitioning to minimize the communications overhead between ARM and DSP. By migrating the computations to the DSP, we demonstrate a significant speedup for the underlying modular arithmetic with up to 9.24x reduction in execution time, compared to the implementation executing on the ARM Cortex processor. Prototype measurements show an energy reduction of up to 5.3 times. We conclude that a heterogeneous platform offers substantial improvements in performance and energy, but we also point out that the cost of inter-processor communication cannot be ignored.
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