A. Ohta, Ming-Chun Tien, S. Neale, Kyoungsik Yu, M. Wu
{"title":"用侧场光电镊在硅上组装III-V型微盘激光器","authors":"A. Ohta, Ming-Chun Tien, S. Neale, Kyoungsik Yu, M. Wu","doi":"10.1109/INOW.2008.4634500","DOIUrl":null,"url":null,"abstract":"A room-temperature optofluidic assembly process to integrate III-V microdisk lasers on a silicon chip is demonstrated. The assembly is accomplished using lateral-field optoelectronic tweezers, which achieves a placement accuracy of approximately plusmn 0.25 mum.","PeriodicalId":112256,"journal":{"name":"2008 International Nano-Optoelectronics Workshop","volume":"174 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Assembly of III–V microdisk lasers on silicon using lateral-field optoelectronic tweezers\",\"authors\":\"A. Ohta, Ming-Chun Tien, S. Neale, Kyoungsik Yu, M. Wu\",\"doi\":\"10.1109/INOW.2008.4634500\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A room-temperature optofluidic assembly process to integrate III-V microdisk lasers on a silicon chip is demonstrated. The assembly is accomplished using lateral-field optoelectronic tweezers, which achieves a placement accuracy of approximately plusmn 0.25 mum.\",\"PeriodicalId\":112256,\"journal\":{\"name\":\"2008 International Nano-Optoelectronics Workshop\",\"volume\":\"174 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-09-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 International Nano-Optoelectronics Workshop\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/INOW.2008.4634500\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 International Nano-Optoelectronics Workshop","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/INOW.2008.4634500","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Assembly of III–V microdisk lasers on silicon using lateral-field optoelectronic tweezers
A room-temperature optofluidic assembly process to integrate III-V microdisk lasers on a silicon chip is demonstrated. The assembly is accomplished using lateral-field optoelectronic tweezers, which achieves a placement accuracy of approximately plusmn 0.25 mum.
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