紧凑的射频MEMS天线与硅衬底

2018 IEEE 2nd International Conference on Circuits, System and Simulation (ICCSS) Pub Date : 2018-07-01 DOI:10.1109/CIRSYSSIM.2018.8525995

Xiaoming Zhu, Baisen Liu, Xiaoguang Wang

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引用次数: 2

摘要

本文采用高介电常数硅作为衬底，设计了新型MEMS天线。提出了带后腔硅天线的设计方法。通过刻蚀后的矩形空腔形成硅与空气的混合结构，降低了硅衬底的有效介电常数，减小了表面波损耗。设计了采用光蚀刻和ICP腔蚀刻工艺制备MEMS天线的工艺步骤。仿真和实测结果表明，该天线具有超宽的频率带宽和良好的全向辐射性能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Compact RF MEMS Antenna with Silicon Substrate

High dielectric constant silicon is used as substrate to design new style MEMS antenna in this paper. The design method of silicon antenna with back cavity is proposed. The back rectangular cavity is etched to form hybrid structure of silicon and air, which can lower effective dielectric constant and reduce surface wave loss of silicon substrate. The MEMS processing steps are designed to fabricate MEMS antenna with photoetching and ICP cavity etching process. The simulated and measured results show the compact MEMS antenna has ultra-wide frequency bandwidth and good omni-direction radiation performance.

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来源期刊

2018 IEEE 2nd International Conference on Circuits, System and Simulation (ICCSS)

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