{"title":"日本手机半导体封装技术","authors":"G. Murakami","doi":"10.1109/POLYTR.2001.973249","DOIUrl":null,"url":null,"abstract":"In semiconductor packaging technology for mobile phones, rapid development in materials, structures, manufacturing methods, and design architecture are making it possible to create phones with higher density, lighter weight, and better performance than ever before. Innovations in polymer materials are largely responsible for such improvements. Future-generation mobile phones are required to keep up with wireless communications on higher-speed transmission. Due to this requirement, the mobile phone industry expects engineers to develop new polymer materials capable of keeping circuitry free from electrical noise even under high-speed operation.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Semiconductor packaging technology for mobile phones in Japan\",\"authors\":\"G. Murakami\",\"doi\":\"10.1109/POLYTR.2001.973249\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In semiconductor packaging technology for mobile phones, rapid development in materials, structures, manufacturing methods, and design architecture are making it possible to create phones with higher density, lighter weight, and better performance than ever before. Innovations in polymer materials are largely responsible for such improvements. Future-generation mobile phones are required to keep up with wireless communications on higher-speed transmission. Due to this requirement, the mobile phone industry expects engineers to develop new polymer materials capable of keeping circuitry free from electrical noise even under high-speed operation.\",\"PeriodicalId\":282338,\"journal\":{\"name\":\"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)\",\"volume\":\"15 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-10-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/POLYTR.2001.973249\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/POLYTR.2001.973249","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Semiconductor packaging technology for mobile phones in Japan
In semiconductor packaging technology for mobile phones, rapid development in materials, structures, manufacturing methods, and design architecture are making it possible to create phones with higher density, lighter weight, and better performance than ever before. Innovations in polymer materials are largely responsible for such improvements. Future-generation mobile phones are required to keep up with wireless communications on higher-speed transmission. Due to this requirement, the mobile phone industry expects engineers to develop new polymer materials capable of keeping circuitry free from electrical noise even under high-speed operation.
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