{"title":"一种带有背板支撑柱的表面微机械MEMS电容式传声器","authors":"C. Je, Jaewoo Lee, Woo-Seok Yang, Jong-Kee Kwon","doi":"10.1109/ICSENS.2013.6688399","DOIUrl":null,"url":null,"abstract":"We present a new surface micromachined MEMS capacitive microphone with improved frequency response and high sensitivity. The proposed MEMS microphone has a top back-plate with a bottom sensing membrane and the back-plate is supported by supporting pillars which are anchored to the bottom of the deep back chamber. The back-plate supporting pillars increase the stiffness of the back-plate and prevent deformation. A present surface micromachined MEMS capacitive microphone is fabricated using fully CMOS compatible processes. It has a thin metal membrane of 500 μm diameter, a sensing air gap of 2.5 μm and seven back-plate supporting pillars. A 100 μm deep back chamber is formed by xenon difluoride dry etching of silicon substrate. As a result, the proposed microphone shows a flat frequency response and high open-circuit sensitivity. It shows a measured zero-bias capacitance of 1.0 pF and a pull-in voltage of 11.0 V, and an open-circuit sensitivity of 10.37 mV/Pa on a DC bias of 6.0 V.","PeriodicalId":258260,"journal":{"name":"2013 IEEE SENSORS","volume":"49 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"A surface micromachined MEMS capacitive microphone with back-plate supporting pillars\",\"authors\":\"C. Je, Jaewoo Lee, Woo-Seok Yang, Jong-Kee Kwon\",\"doi\":\"10.1109/ICSENS.2013.6688399\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We present a new surface micromachined MEMS capacitive microphone with improved frequency response and high sensitivity. The proposed MEMS microphone has a top back-plate with a bottom sensing membrane and the back-plate is supported by supporting pillars which are anchored to the bottom of the deep back chamber. The back-plate supporting pillars increase the stiffness of the back-plate and prevent deformation. A present surface micromachined MEMS capacitive microphone is fabricated using fully CMOS compatible processes. It has a thin metal membrane of 500 μm diameter, a sensing air gap of 2.5 μm and seven back-plate supporting pillars. A 100 μm deep back chamber is formed by xenon difluoride dry etching of silicon substrate. As a result, the proposed microphone shows a flat frequency response and high open-circuit sensitivity. It shows a measured zero-bias capacitance of 1.0 pF and a pull-in voltage of 11.0 V, and an open-circuit sensitivity of 10.37 mV/Pa on a DC bias of 6.0 V.\",\"PeriodicalId\":258260,\"journal\":{\"name\":\"2013 IEEE SENSORS\",\"volume\":\"49 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-12-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 IEEE SENSORS\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICSENS.2013.6688399\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE SENSORS","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSENS.2013.6688399","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A surface micromachined MEMS capacitive microphone with back-plate supporting pillars
We present a new surface micromachined MEMS capacitive microphone with improved frequency response and high sensitivity. The proposed MEMS microphone has a top back-plate with a bottom sensing membrane and the back-plate is supported by supporting pillars which are anchored to the bottom of the deep back chamber. The back-plate supporting pillars increase the stiffness of the back-plate and prevent deformation. A present surface micromachined MEMS capacitive microphone is fabricated using fully CMOS compatible processes. It has a thin metal membrane of 500 μm diameter, a sensing air gap of 2.5 μm and seven back-plate supporting pillars. A 100 μm deep back chamber is formed by xenon difluoride dry etching of silicon substrate. As a result, the proposed microphone shows a flat frequency response and high open-circuit sensitivity. It shows a measured zero-bias capacitance of 1.0 pF and a pull-in voltage of 11.0 V, and an open-circuit sensitivity of 10.37 mV/Pa on a DC bias of 6.0 V.