MEMS压力传感器低成本封装的开发

2014 IEEE 9th IberoAmerican Congress on Sensors Pub Date : 2014-12-29 DOI:10.1109/IBERSENSOR.2014.6995521

Diego Conte Ayala Penalver, H. Furlan, Mariana Amorim Fraga

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引用次数: 0

摘要

基于不同材料类型(陶瓷，塑料和金属)的MEMS传感器封装的开发已经投入了大量的研究工作。本文描述了一种高可靠性、低成本的金属封装的设计、制造和测试。我们研究的新颖之处在于用机械干涉代替昂贵的等离子焊接工艺来组装传统金属包装。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Development of a low-cost packaging for MEMS pressure sensors

Considerable research efforts have been devoted to the development of MEMS sensor packaging based on different material types (ceramic, plastic and metal). In this work, we describe the design, fabrication and test of a metal packaging with high reliability and low cost. The novelty of our research is on the packaging assembly by mechanical interference replacing the expensive plasma welding process that is used commonly in the development of traditional metal packaging.

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2014 IEEE 9th IberoAmerican Congress on Sensors

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