玻璃基封装的d波段准八木天线

Serhat Erdogan, Madhavan Swaminathan
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引用次数: 3

摘要

本文介绍了一种在d波段工作的低损耗聚合物增强膜玻璃基板上印制单极辐射体准八木天线的设计、制作和测量结果。模拟天线的峰值增益为6.2 dBi,测量阻抗带宽$\left(\left|S_{11}\right|\lt-10 \mathrm{~dB}\right)$覆盖整个d波段$(110-170 \mathrm{GHz})$。天线尺寸为$0.887 \mathrm{~mm}$$\times 0.919 \mathrm{~mm}$, 140 GHz时为$0.413 \lambda_{0} \times 0.429 \lambda_{0}$。回波损耗测量显示高重复性。天线的宽带宽,高模拟增益,紧凑的尺寸,以及玻璃基封装在支持使用玻璃面板嵌入的高集成度方面的优势,使其适合用于d波段次太赫兹无线通信的手机设备。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
D-band Quasi-Yagi Antenna in Glass-based Package
This paper presents design, fabrication and measurement results of a printed quasi-Yagi antenna with monopole radiator on glass substrate with low-loss polymer buildup films operating in D-band. Simulated peak gain of the antenna is 6.2 dBi, measured impedance bandwidth $\left(\left|S_{11}\right|\lt-10 \mathrm{~dB}\right)$ covers the entire D-band $(110-170 \mathrm{GHz})$. Size of the antenna is $0.887 \mathrm{~mm}$ $\times 0.919 \mathrm{~mm}$, or $0.413 \lambda_{0} \times 0.429 \lambda_{0}$ at 140 GHz. Return loss measurements show high repeatability. Wide bandwidth of the antenna, high simulated gain, compact size, and advantages of glass-based packages in terms of supporting high level of integration using Glass Panel Embedding makes it suitable for handset devices for sub-THz wireless communications in D-band.
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