液滴在超疏水表面的加热和蒸发:初步结果

D. Antonov, R. Fedorenko, P. Strizhak, S. Sazhin
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引用次数: 0

摘要

研究液滴在疏水(接触角~ 110°)和超疏水(接触角~ 160°)表面上的加热和蒸发的重要性是众所周知的。文献[2,3]中已经提出并描述了这种现象的几种模型。然而,迄今为止所描述的所有模型都是基于相关输运方程的数值解,在许多情况下,它们对实际工程问题分析的适用性受到限制。这篇摘要的重点是关于这种现象的一个新的简单模型的初步结果。该模型可以捕获过程的最重要特征,并且对于大多数工程应用来说足够简单。新模型假设液滴与超疏水表面的接触面积远小于液滴表面的面积。这个假设允许我们把液滴的加热和蒸发看作球对称过程。通过液滴与表面的接触区域提供给液滴的热量被认为是微扰。用球对称热传导方程描述了液滴被周围气体加热的过程,该方程具有液滴表面的Robin边界条件。采用有效导热系数模型,通过对液体导热系数的修正来考虑环境空气速度的影响。热传导方程的解析解被合并到数值代码中,并在每个地方使用
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Heating and Evaporation of Droplets on a Super-hydrophobic Surface: Preliminary Results
Extended Abstract The importance of investigating the heating and evaporation of droplets on hydrophobic (contact angle ∼ 110°) and superhydrophobic (contact angle ∼ 160°) surfaces is well known [1]. Several models of the phenomena have been suggested and described in the literature [2,3]. All the models described so far, however, have been based on numerical solutions to the relevant transport equations and their applicability to the analysis of practical engineering problems is limited in many cases [3]. This abstract is focused on the preliminary results of the development of a new simple model of the phenomena. This model can capture the most important features of the processes and is simple enough for most engineering applications . The new model assumes that the contact area of the droplet with the superhydrophobic surface is much smaller than the area of the droplet surface. This assumption allows us to consider the droplet heating and evaporation as spherically symmetric processes. Heat supply to the droplet through the contact area of the droplet with the surface is considered as perturbation. Heating of the droplet by ambient gas is described by a spherically symmetric heat conduction equation with the Robin boundary condition at the droplet surface. The effective thermal conductivity model, in which the effect of ambient air velocity is accounted for by the modification of the liquid thermal conductivity, was used. The analytical solution to the heat conduction equation is incorporated into the numerical code and used at each
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