物理厚度xnm铁电HfZrOx负电容场效应管

M. H. Lee, Sheng-Ting Fan, C.-H. Tang, P. Chen, Y.-C. Chou, H. Chen, J. Kuo, M. Xie, S.-N. Liu, M. Liao, C. Jong, K.-S. Li, M.-C. Chen, C. Liu
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引用次数: 111

摘要

实验证明了铁电HfZrOx (FE-HZO)负电容(NC) fet的物理厚度为1.5 nm, SS = 52 mV/dec,无迟滞(阈值电压位移= 0.8 mV), CET(电容等效厚度)为0.65 nm。在标准14nm FinFET上验证了NC-FinFET建模。栅极电压三角形扫频显示了栅极和漏极电流响应的瞬态特性。建立了具有紧凑等效电路的超薄FE-HZO动态数控模型,并对实验数据进行了验证,估计了其快速响应。一种可行的超薄FE-HZO(1)耦合概念。采用NC作为栅极堆栈,为亚10nm技术节点提供了一种很有前途的解决方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Physical thickness 1.x nm ferroelectric HfZrOx negative capacitance FETs
Ferroelectric HfZrOx (FE-HZO) negative capacitance (NC) FETs is experimentally demonstrated with physical thickness 1.5 nm, SS = 52 mV/dec, hysteresis free (threshold voltage shift = 0.8 mV), and 0.65 nm CET (capacitance equivalent thickness). The NC-FinFET modeling is validated on standard 14nm FinFET. The transient behavior of gate and drain current response are exhibited with triangular gate voltage sweep. The dynamic NC model with compact equivalent circuit for ultra-thin FE-HZO is established with experimental data validation, and estimates the fast response. A feasible concept of coupling the ultra-thin FE-HZO (1.x nm) with NC as gate stack paves a promising solution for sub-10nm technology node.
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