WLCSP构件欠填效应的实验研究

2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of Pub Date : 2004-09-27 DOI:10.1109/AGEC.2004.1290913

Y.S. Chen, C.S. Wang, A.C. Shiah

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引用次数: 0

摘要

对于最新开发的BGA组件，例如倒装BGA和晶圆级csp (WLCSP)，在投入批量生产之前都需要进行可靠性测试。在电子元件的机械应力测试中，最常见的是振动测试、弯曲测试和冲击测试。在印刷电路板上安装焊料球的电子元件的剪切测试是很少见的。本文通过一系列的剪切试验和弯曲试验，探讨了不同的下填土形式对混凝土混凝土混凝土的影响。这项技术适用于新的包装设计，甚至适用于那些使用环保材料的包装。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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An experimental study of the under-fill effects for WLCSP components

For the most recent developed BGA components, such as flip chip BGAs and wafer level CSPs (WLCSP), all are required to have reliability tests conducted before being launched into mass production. Among the mechanical stress tests for electronic components, the most commonly seen are vibration tests, bend tests and shock tests. Rarely seen is the shear test for an electronic component with solder balls mounted on the printed circuit boards. This paper discusses the effects of various under-fills on a WLCSP through a series of shear tests and bend tests. The technique is applicable to new package designs, even for those with environmentally compatible materials.

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2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of

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