Han Gao, S. De, Brent Beingessner, Steve Payne, J. Drewniak
{"title":"高速信号传播中条子式回钻冲击的失配","authors":"Han Gao, S. De, Brent Beingessner, Steve Payne, J. Drewniak","doi":"10.1109/EMCSI.2018.8495160","DOIUrl":null,"url":null,"abstract":"Nowadays, plated-through hole (PTH) via structures are extensively used in printed circuit boards (PCBs). As the data rate increases to Gigahertz range, the via stub resonance effect shows up, which will cause signal distortion and lead to signal integrity issue. In this paper, the impact caused by backdrill mis-registration issue is investigated.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Mis-registration of Sliver Type Backdrill Impact in High Speed Signal Propagation\",\"authors\":\"Han Gao, S. De, Brent Beingessner, Steve Payne, J. Drewniak\",\"doi\":\"10.1109/EMCSI.2018.8495160\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Nowadays, plated-through hole (PTH) via structures are extensively used in printed circuit boards (PCBs). As the data rate increases to Gigahertz range, the via stub resonance effect shows up, which will cause signal distortion and lead to signal integrity issue. In this paper, the impact caused by backdrill mis-registration issue is investigated.\",\"PeriodicalId\":120342,\"journal\":{\"name\":\"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EMCSI.2018.8495160\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMCSI.2018.8495160","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Mis-registration of Sliver Type Backdrill Impact in High Speed Signal Propagation
Nowadays, plated-through hole (PTH) via structures are extensively used in printed circuit boards (PCBs). As the data rate increases to Gigahertz range, the via stub resonance effect shows up, which will cause signal distortion and lead to signal integrity issue. In this paper, the impact caused by backdrill mis-registration issue is investigated.