3D异构集成实现未来射频集成电路

2018 IEEE Radio and Wireless Symposium (RWS) Pub Date : 1900-01-01 DOI:10.1109/RWS.2018.8304982

Qi Chen, Chenkun Wang, Feilong Zhang, Cheng Li, Albert Z. H. Wang

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引用次数: 1

摘要

高性能射频集成电路(RF ic)是无线系统的核心。虽然CMOS缩放和集成对现代RF ic有益，但未来的RF ic需要超越摩尔的技术。本文综述了用于下一代射频集成电路的3D异构集成技术的最新进展，包括垂直磁芯电感器、通过后端线(BEOL)金属壁串扰隔离和ic上石墨烯开关静电放电(ESD)保护。

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3D heterogeneous integration enabling future RF ICs

High-performance radio frequency integrated circuit (RF ICs) is the core of wireless systems. While CMOS scaling and integration have been beneficial to modern RF ICs, future RF ICs call for More-Than-Moore technologies. This paper reviews recent advances in developing enabling 3D heterogeneous integration technologies for next-generation RF ICs, including vertical magnetic-cored inductors, through-back-end-of-line (BEOL) metal wall crosstalk isolation and above-IC graphene switch electrostatic discharging (ESD) protection.

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2018 IEEE Radio and Wireless Symposium (RWS)

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