SIP电源装置侧裂的研究

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits Pub Date : 1997-07-21 DOI:10.1109/IPFA.1997.638211

C. Premachandran, E.M. Palmeda, T. C. Chai

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引用次数: 2

摘要

SIP封装在装配过程中容易产生侧模裂纹。通过对侧模裂纹的研究，更好地了解了可能的失效机理，并找到了改进的方法。在本研究中，进行了实验和有限元模拟。模拟结果与实验结果吻合较好。在此基础上，对SIP封装的设计方法进行了改进。有可能构建具有更好的抗侧模裂纹的SIP封装，从而进一步提高其质量和可靠性。

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Investigation for lateral diecrack on SIP power device

SIP packages were found to be susceptible to lateral die crack during assembly process. An investigation into the lateral die crack has led to better understanding of the possible failure mechanism and solutions for improvement have been found. In this study both experimental and FEA simulation were carried out. The simulated results can correlate well with experimental observation. Based on this work the design methodology for the SIP package have been improved. It is possible to build SIP packages with better resistant to lateral die crack and hence further enhance its quality and reliability.

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Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits

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